Broadcom Corporation , a global innovation leader in semiconductor solutions for wired and wireless communications, today introduced a new location architecture to provide more responsive outdoor and indoor positioning capabilities for smartphone devices. With proven third-generation multi-constellation support and tight integration with sensor components and Broadcom's industry-leading connectivity sub-system, the new solution opens the door to innovative applications, such as indoor positioning and place-based mobile commerce. For more news, visit Broadcom's Newsroom.
The architecture features a new Global Navigation Satellite System (GNSS) chip that significantly reduces time-to-first-fix (TTFF) for outdoor positioning applications,The most commonly used injectionmould process, cutting the time smartphone users have to wait when first checking their position.GOpromos offers a wide selection of promotional items and personalized gifts. The platform solution also uses data from inertial sensors,To interact with beddinges, Wi-Fi access points (including those based on recently announced 5G WiFi) and future technologies such as Bluetooth beacons to enable ground breaking indoor positioning capabilities, such as "personal shopper" applications that can direct users to specific stores within shopping malls,Why does mould grow in homes or buildings? and even specific shelves within those stores. In addition, platform integration with NFC enables smarter, more secure mobile payments, with users able to specify countries, cities or even stores where digital wallets can be used.
The Broadcom BCM4752 GNSS chip provides the industry's most advanced multi-constellation support by simultaneously collecting data from four satellite constellations (GPS, GLONASS,Learn all about solarpanel, QZSS and SBAS) and using the best received signals, resulting in faster searches and more accurate real-time navigation. Building on the success of previous GNSS chips, Broadcom's multi-constellation technology, coupled with advanced signal processing, provides faster positioning performance for improved user experience, especially in challenging urban environments where buildings and obstructions can dramatically impact accuracy and time-to-fix.
The new chip and accompanying software benefit from tight integration with Broadcom's InConcert wireless connectivity sub-system, featuring the most advanced and complete technology offering in the industry. By developing its various connectivity components to operate as a unified system, Broadcom can offer more expansive location features that extend beyond GNSS capabilities.
The architecture features a new Global Navigation Satellite System (GNSS) chip that significantly reduces time-to-first-fix (TTFF) for outdoor positioning applications,The most commonly used injectionmould process, cutting the time smartphone users have to wait when first checking their position.GOpromos offers a wide selection of promotional items and personalized gifts. The platform solution also uses data from inertial sensors,To interact with beddinges, Wi-Fi access points (including those based on recently announced 5G WiFi) and future technologies such as Bluetooth beacons to enable ground breaking indoor positioning capabilities, such as "personal shopper" applications that can direct users to specific stores within shopping malls,Why does mould grow in homes or buildings? and even specific shelves within those stores. In addition, platform integration with NFC enables smarter, more secure mobile payments, with users able to specify countries, cities or even stores where digital wallets can be used.
The Broadcom BCM4752 GNSS chip provides the industry's most advanced multi-constellation support by simultaneously collecting data from four satellite constellations (GPS, GLONASS,Learn all about solarpanel, QZSS and SBAS) and using the best received signals, resulting in faster searches and more accurate real-time navigation. Building on the success of previous GNSS chips, Broadcom's multi-constellation technology, coupled with advanced signal processing, provides faster positioning performance for improved user experience, especially in challenging urban environments where buildings and obstructions can dramatically impact accuracy and time-to-fix.
The new chip and accompanying software benefit from tight integration with Broadcom's InConcert wireless connectivity sub-system, featuring the most advanced and complete technology offering in the industry. By developing its various connectivity components to operate as a unified system, Broadcom can offer more expansive location features that extend beyond GNSS capabilities.
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